本文是以新型气隙式膜蒸馏冷腔为研究对象，拟寻求合适的制冷源来代替大型、高耗能的制冷机。对新型空气隙膜组件与半导体制冷片的匹配理论进行了研究，并且做了耦合设计。实验采用空气强制对流散冷和循环水浴散热的方式，测试分析在特定条件下半导体冷端温度的变化规律，探求适合于空气隙膜蒸馏冷腔的片数及运行工况。研究结果表明，半导体制冷片不但响应时间迅速，而且长时间运行稳定性好。散热循环水浴流量对半导体冷端的温度影响很大。在风机风量600m3/h，室温22℃，散热循环水浴流量700L/h，水温20℃的条件下，输入电流I=20A时，半导体冷端温度是8.86℃，制冷量是112.83W，在膜面积为0.0104m2时，可以达到膜蒸馏冷腔所需的温度条件。可以作为优化新型气隙式膜组件冷腔的首选方案。

This paper is based on the new air gap membrane distillation cooling cavity as the object of study for seeking a suitable refrigeration source instead of large, high energy consumption of the refrigerating machine. Study the matching theory of the new air gap membrane distillation components and semiconductor refrigeration, at the same time, making the coupling design.To use forced convection cold dispersion and circulator bath cooling way, under specific conditions test analysis semiconductor cold end temperature variation, explore suitable for semiconductor number and operation conditions of air gap membrane distillation cooling cavity. Research results show that there has a great effect on the semiconductor cold end temperature for cooling circulating water flow rate. Besides also have advantages, such as suitable for long time operation, rapid cooling, good stability and so all. It can be true that semiconductor cold end temperature can reach the desired temperature conditions of membrane distillation cooling cavity, in the conditions of the fan air volume is 600m3/h, room temperature is 24℃, cooling circulating water flow is 700L/h, water temperature is 20℃, input current is 20A. In these conditions the semiconductor cold end temperature is 8.86℃,refrigerating capacity is 112.83W and membrane area is 0.0104 m2. It can be used as the preferred scheme of optimization air gap new membrane component cooling cavity.

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